Designed for stable high-density PCB interconnection with LCP housing and copper-alloy contacts for consumer electronics, industrial control, and communication equipment.
| Pitch | 0.8mm |
| Circuits | 20 Circuits |
| Rows | Single Row |
| Mounting | SMT |
| Stack Height | 3.0mm |
| Current Rating | 1.0A |
| Voltage Rating | 100V AC |
| Contact Material | Copper Alloy, Gold Flash |
| Housing Material | LCP UL94V-0 |
| Operating Temperature | -40掳C~+105掳C |
| Contact Resistance | 20m惟 Max |
10 circuits, 1.5mm stack height, rated current 1.5A.
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20 circuits, 5.0mm stack height, rated current 0.5A.
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40 circuits, 1.5mm stack height, rated current 1.5A.
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