Designed for stable high-density PCB interconnection with LCP housing and copper-alloy contacts for consumer electronics, industrial control, and communication equipment.
| Pitch | 0.5mm |
| Circuits | 40 Circuits |
| Rows | Triple Row |
| Mounting | SMT |
| Stack Height | 5.0mm |
| Current Rating | 0.5A |
| Voltage Rating | 50V AC |
| Contact Material | Copper Alloy, Gold Flash |
| Housing Material | LCP UL94V-0 |
| Operating Temperature | -40掳C~+105掳C |
| Contact Resistance | 20m惟 Max |